Speakers

Dana Pack is President of the Americas for Smart Cooling Technologies, bringing more than 15 years of expertise in high-pressure evaporative cooling. Throughout his career, he has led the development and application of engineered cooling and humidification solutions across a wide range of industrial and mission-critical environments.

Dana has been instrumental in Smart Cooling Technologies' expansion throughout the Americas by leveraging strategic partnerships, long-standing industry relationships, and a customer-focused approach to solving complex thermal management challenges.

Drawing on a leadership background with large corporate organizations, Dana specializes in translating proven cooling technologies into practical, field-deployable solutions for mission-critical facilities. He works closely with data center owners, operators, contractors, and engineering firms to implement high-pressure, on demand chiller pre-cooling strategies that mitigate high-ambient risk, improve Power Usage Effectiveness (PUE), stabilize condenser performance, and increase operational resilience.

Dana is passionate about helping the data center industry improve energy efficiency, maximize available cooling capacity, and maintain uptime through innovative, reliable cooling solutions