ZutaCore's HyperCool® platform uses a closed-loop, low-pressure, waterless two-phase cooling system that efficiently removes heat directly from the processor while eliminating the risks associated with water inside servers. The technology supports the latest generation of AI CPUs and GPUs, enabling higher rack densities, sustained processor performance and significantly improved energy efficiency. It is designed for both new AI factories and existing data centres looking to upgrade for next-generation workloads.
Beyond performance, HyperCool helps operators address some of the industry's biggest challenges: reducing cooling energy consumption, increasing compute density, supporting heat reuse strategies, lowering total cost of ownership and advancing sustainability goals by eliminating water from the server environment. The solution is supported by a growing ecosystem of leading server manufacturers and infrastructure partners, helping customers accelerate AI deployments with confidence.
At DataCloud USA, visit ZutaCore to learn how waterless liquid cooling is enabling the next generation of AI infrastructure. ZutaCore will also be moderating the panel discussion, "Keeping it cool – Evaluating air, liquid and hybrid approaches for high-density workloads," bringing together industry leaders to explore the practical considerations, trade-offs and future direction of cooling technologies as AI drives ever-higher rack densities and power requirements.
www.zutacore.com
