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Panel – Keeping it cool: evaluating air, liquid and hybrid approache
Increasing AI rack densities are driving the adoption of hybrid air-liquid cooling, with direct-to-chip cooling leading near-term. This panel explores:
• From interconnection to interoperability: where are the key challenges among CDU deployments?
• As density increases, how is rapid damage or fire risk being prevented in cooling?
• Championing water stewardship: how can closed-loop design help?
