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Panel: Keeping it cool - Evaluating air, liquid and hybrid approaches for high density workloads
Increasing AI rack densities are driving the adoption of hybrid air-liquid cooling, with direct-to-chip cooling leading near-term. This panel explores:
• From interconnection to interoperability: where are the key challenges among CDU deployments?
• As density increases, how is rapid damage or fire risk being prevented in cooling?
• Championing water stewardship: how can closed-loop design help?
